Deadline Extension & Program Highlights >> IEEE SPI 2025


Dear Friends and Colleagues,

The Full Paper Submission will be extended until next month:

NEW DEADLINE - Full Paper Submission: December 20th, 2024 January 17th, 2025

We are grateful for the submissions received so far and keen to welcome further original and unpublished contributions on all aspects of Signal and Power Integrity!

SCIENTIFIC PROGRAM HIGHLIGHTS

Meet our first confirmed Speakers

Wendem Beyene, Analog & Mixed Signal Architect in Reality Labs at Meta Platforms, will deliver a keynote talk about the challenges in Signal and Power Integrity to meet the demands of expanding and evolving compute platforms.

Andrea Ferrari, Director of the Cambridge Graphene Centre and Science and Technology Officer of the European Graphene Flagship, will deliver a keynote talk about the current status and future perspectives of nanomaterials integration into electronics.

Special Session: Industry Panel

The workshop will host an Industry Panel to discuss the Signal and Power Integrity challenges related to the GaN-based power electronics applications.

SPONSORSHIPS

We are delighted to welcome

STMicroelectronics as our Platinum Sponsor!

Your Company can also support SPI 2025 with a sponsorship and seize this prime opportunity to promote SI/PI-related products and services to our participants! Sponsor Registration is open!

Feel free to broadcast SPI 2025 in your institution or company and to your fellow colleagues and students. It is a pleasure to invite you all to the 29th IEEE Workshop on Signal and Power Integrity and we look forward to your contribution and participation!

On behalf of the Committees,​

Antonio Maffucci, Workshop Chair

Mihai Telescu & Dries Vande Ginste, Program Chairs

SPI 2025 – 29th IEEE Workshop on Signal and Power Integrity

May 11-14, 2025 – Gaeta, Italy

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SPI 2025 - 29th IEEE Workshop on Signal and Power Integrity

The IEEE Workshop on Signal and Power Integrity (SPI) is an annual scientific event dedicated to all aspects of Signal and Power Integrity, comprising the latest research and developments on design, characterization, modeling, simulation and testing at chip, package, board, and system level. Aiming to bring together developers and researchers from academia and industry in order to encourage cooperation, the workshop's technical program will include both oral and poster sessions, while several prominent experts will be giving keynotes and tutorials on areas of emerging interest. SPI 2025 will be held as an in-person event during May 11-14, 2025, in Gaeta, Italy.

Read more from SPI 2025 - 29th IEEE Workshop on Signal and Power Integrity

View this email in your browser Dear Friends and Colleagues, The Full Paper Submission Deadline is just five weeks away! Authors working on all aspects of Signal and Power Integrity are encouraged to send us original and unpublished contributions until December 20th, 2024: Submit your Paper now ➤ Accepted papers will be included in the workshop’s program and submitted for inclusion into IEEE Xplore (subject to meeting scope and quality requirements for IEEE Xplore).➤ Authors of the best...

View this email in your browser Dear Friends and Colleagues, Paper Submission is open for the 29th IEEE Workshop on Signal and Power Integrity, to be held during May 11-14, 2025, in Gaeta, Italy. The Full Paper Submission Deadline is December 20th, 2024. Original and unpublished contributions on all aspects of Signal and Power Integrity are welcomed, related to the following topics of interest: Modeling and simulation for SI/PI Coupled signal and power integrity analysis Noise reduction and...

Click here to read this email in your browser Dear Friends and Colleagues, We are delighted to officially announce the 29th IEEE Workshop on Signal and Power Integrity, to be held during May 11-14, 2025, in Gaeta, Italy. Website SPI 2025 Standing for almost three decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a noteworthy forum of exchange on all aspects of Signal and Power Integrity, comprising the latest research and developments on design, characterization,...