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IEEE Workshop on Signal and Power Integrity

Paper Submission OPEN >> IEEE SPI 2025

Published 9 months ago • 1 min read

Dear Friends and Colleagues,

Paper Submission is open for the 29th IEEE Workshop on Signal and Power Integrity, to be held during May 11-14, 2025, in Gaeta, Italy. The Full Paper Submission Deadline is December 20th, 2024.

Original and unpublished contributions on all aspects of Signal and Power Integrity are welcomed, related to the following topics of interest:

  • Modeling and simulation for SI/PI​
  • Coupled signal and power integrity analysis
  • Noise reduction and equalization techniques
  • High-speed link design and modeling
  • Power distribution networks
  • RF/microwave/mm-wave systems and packaging solutions
  • Antennas-in-package and antennas-on-chip
  • 3D IC and packages (TSV/SiP/SoC)
  • Nano-interconnects and nano-structures
  • Electromagnetic theory and modeling
  • Transmission line theory and modeling
  • Macromodeling, reduced order models
  • Electromagnetic compatibility
  • Design methodology/flow measurements
  • Jitter and noise modeling
  • Stochastic/sensitivity analysis
  • Electro-thermal modeling
  • Chip-package co-design
  • Novel CAD concepts
  • Optical interconnects
  • AI in electronics design

➤ Accepted papers will be included in the workshop’s program and submitted for inclusion into IEEE Xplore (subject to meeting scope and quality requirements for IEEE Xplore).
➤ Authors of the best ranked accepted papers will have the opportunity to submit an extended version of their work for publication in a special section of the IEEE Transactions on Components, Packaging and Manufacturing Technology.

SPI 2025 AWARDS & GRANTS

  • BEST PAPER AWARD - Recognizes the foremost paper among all papers submitted and presented during the workshop.
  • BEST STUDENT PAPER AWARD - Recognizes excellence in research for submitted papers primarily authored and presented by a student at the workshop.
  • IEEE EPS STUDENT TRAVEL GRANTS - To support costs directly tied to the event’s attendance, the IEEE Electronics Packaging Society will provide a special Travel Grant to two students presenting their work at the workshop.

SPONSORSHIPS

Your Company can actively support SPI 2025 with a sponsorship and take advantage of this key opportunity to promote products and services to our participants! Several sponsorship opportunities are available to choose from, each one with different marketing opportunities and attractive benefits, including Full Regular Registrations for Company representatives. Sponsor Registration is open!

Feel free to broadcast SPI 2025 in your institution or company, and to your fellow colleagues and students. It is a pleasure to invite you all to the 29th IEEE Workshop on Signal and Power Integrity and we look forward to your contribution and participation!

On behalf of the Committees,​

​

Antonio Maffucci, Workshop Chair

Mihai Telescu & Dries Vande Ginste, Program Chairs

SPI 2025 – 29th IEEE Workshop on Signal and Power Integrity

May 11-14, 2025 – Gaeta, Italy

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IEEE Workshop on Signal and Power Integrity

The IEEE Workshop on Signal and Power Integrity (SPI) is an annual scientific event dedicated to all aspects of Signal and Power Integrity, comprising the latest research and developments on design, characterization, modeling, simulation and testing at chip, package, board, and system levels. Aiming to bring together researchers and developers from academia and industry worldwide in order to encourage cooperation, the workshop's technical program includes both oral and poster sessions, while several prominent experts present keynotes and tutorials on areas of emerging interest. SPI 2025 was held as an in-person event during May 11-14, 2025, in Gaeta, Italy. The next SPI workshop will be held during June 14-17, 2026, in Torino, Italy.

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